March 2013 cover

 

FEATURES

    Apex Expo Recap
    Let’s Get Small
    At IPC Apex Expo this year, small was big. Benchtop was in and integration was all the rage at the annual North American trade show.
    by Mike Buetow

    Cover Story
    Bridging Technology between Conventional 3D and TSV 3D Stacking
    Two new multi-die DRAM packages have thin profiles and minimize wirebond length.
    by Belgacem Haba, Ph.D.

    SMT Automation
    Robotics Assembly from Prototype to Production
    Behind every robot is the manufacturing assembly process of how the robot was built. Here, the author details some key areas of the Benchmark Electronics’ Robotics manufacturing process, from a prototype or new-build stage to steady-state production.
    by Scott Mazur

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    I will, I promise.
    Peter Bigelow

 

TECH TALK

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article