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FEATURES

Apex Expo Recap
Let’s Get Small
At IPC Apex Expo this year, small was big. Benchtop was in and integration was all the rage at the annual North American trade show.
by Mike Buetow

Cover Story
Bridging Technology between Conventional 3D and TSV 3D Stacking
Two new multi-die DRAM packages have thin profiles and minimize wirebond length.
by Belgacem Haba, Ph.D.

SMT Automation
Robotics Assembly from Prototype to Production
Behind every robot is the manufacturing assembly process of how the robot was built. Here, the author details some key areas of the Benchmark Electronics’ Robotics manufacturing process, from a prototype or new-build stage to steady-state production.
by Scott Mazur

FIRST PERSON

• Caveat Lector
  Acquiring minds.
  Mike Buetow

• Talking Heads
  Gary Ferrari and the IPC-2221B.
  Mike Buetow

• Talking Heads
  EMS Business on Block, Woods Still Sees Bright Side.
  Mike Buetow

MONEY MATTERS

• ROI
  I will, I promise.
  Peter Bigelow

TECH TALK

• Selective Soldering
  To the point.
  Chris Denney

• Defects Database
  Check your shorts.
  Dr. Chris Hunt

• Test & Inspection
  Getting inline.
  Tian-Chiok Lian and Wee-Sheng Yong

• Getting Lean
  Line design.
  Edward Basconi and Victor Contreras

• Technical Abstracts
  In Case You Missed It.

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