November 2012 cover

 

FEATURES

Advanced Packages
Stepping Out With 0.4mm Pitch BGA/PoPs
OEMs are finding the move from 0.5mm pitch BGA PoP to the next generation, 0.4mm ultra-fine pitch BGA PoP tough, indeed. These rules-of-thumb will help make the jump.
by Syed W. Ali

Associations
The Mitchell Plan
IPC's new president is wasting no time remaking the trade group in his own (attentive) image.
by Mike Buetow

ESD Basics
You're Grounded!
Setting up an ESD workstation or area to reduce the risk of electrostatic discharge in the workplace.
by The ESD Association

Reliability
Electronics Failure Analysis for Pb- and Pb-Free Solder Joints
Why the Weibull distribution is probably the most important distribution for solder material failure analysis.
by Dr. Ron Lasky

Tech Tips
Manufacturing Cost Reduction through Automation
A step-by-step process to cut costs for a high-rel RF tuner.
by ACI Technologies

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article