February 2012 cover

FEATURES

Cover Story
Benchmarking and Qualifying PCB Fabricators for Semiconductor Device Test Boards
Standardized test panels provide a sound basis for engaging with suppliers and participating in continuous improvement plans. Over time, test panel results objectively demonstrate if suppliers are attaining agreed-upon goals.
by William J. Mack

PCB Inspection
Using Automated 3D X-Ray Inspection to Detect BTC Defects
Bottom-termination components such as QFNs are characterized by hidden solder joints, making inspection tricky. Defects such as insufficients often have enough solder present to pass ICT and functional test, but when subjected to shock or vibration, there is a good chance this solder connection will fracture, leading to an open connection.
by Barbara Koczera and An Qi Zhao

Environmental Management
Developing a Compliance System for RoHS2
With the latest directive, RoHS is becoming more focused on validation of process, rather than inspection of results. A look at the methodology of developing a compliance system to address the electronics manufacturer’s obligations.
by Scott Mazur

Stencil Technology
What Used to be Old is New Again?
Recent developments give laser-cut stainless stencils the nod over their electroformed counterparts.
by Chrys Shea

 

FIRST PERSON

    • Caveat Lector
      The DoD fights back.
      Mike Buetow

 

  • Talking Heads
    Asteelflash’s Gilles Benhamou.
    Mike Buetow

 

MONEY MATTERS

    • ROI
      Small talk.
      Peter Bigelow

    • Focus on Business
      Adapting to uncertainty.
      Susan Mucha

 

TECH TALK

  • Screen Printing
    Lights-out printing.
    Clive Ashmore

  • Vapor Phase Soldering
    Save your energy.
    Jochen Lipp

  • Test and Inspection
    ECU coverage.
    Cynthia Chuah

  • Defects Database
    Solder paste contamination.
    Dr. Chris Hunt

  • Technical Abstracts
    In Case You Missed It.

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