April 2011 cover

FEATURES

QA MODELING
Are Current Qualification Practices Adequate?
It is well known that devices and systems pass existing QT only to fail in the field. Other devices undergo extensive – and expensive – testing. Is this a problem? And do we truly understand the cost not just of failure, but of excessive test? A new approach to qualifying electronics devices could ensure a predictable, and low, probability of failure.
by Ephraim Suhir, Ph.D. and Ravi Mahajan, Ph.D.

SOLDER PROFILE
AIM Sets Its Targets
A family run business since 1936, AIM has become one of the world’s five largest electronics solder manufacturers. If only the world electronics industry knew. In an exclusive, Circuits Assembly goes inside the company's vast Montreal manufacturing facilities to find out what makes AIM at once so successful yet so unsung.
by Mike Buetow

SCREEN PRINTING
Testing the Mettle of Stencil Foils
According to our latest design of experiments, foil alloy does influence paste release: Over an area ratio range of approximately 0.5 to 0.75, the best performers were fine grain stainless steel and electropolished stainless steel.
by Chrys Shea

 

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