March 2011 cover

FEATURES

Printing
Impact of Mesh Size and Stencil Technology on Deposition Volume
A study on the impact on solder volume deposition using Type 3, Type 4 and Type 5 SAC 305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils found that paste chemistry and rheology have a more profound effect on release than previously thought.
by Karl Seelig and Tim O’Neill

Reflow
Practical Thermal Profile Expectations in a Dual-Lane, Dual-Speed Reflow Oven
Now that we have the ability to run different speeds in each lane, recipes must be devised that satisfy both boards. Here, we discuss methods for obtaining such recipes.
by Fred Dimock

SPI
Automated Solder Paste Inspection: A New Look at Stencils
Many assemblers have foisted responsibility for automated inspection and verification onto the stencil vendors, referring to them as “qualified” or “certified” suppliers. In essence, they have placed the fox in charge of the henhouse on a portion of their most critical SMT process. While this practice might look good on paper, it’s rife with potential to backfire and ultimately cost more money than it saves.
by Chrys Shea

EMS Top 50
The Great Rebound of 2010
The electronics manufacturing industry will remember 2010 for many reasons: rampant component shortages (and the rise of counterfeits), the tight financial markets and tense end-market conditions. But mostly, it will be remembered for recovery.
by Mike Buetow

 

FIRST PERSON

  • Caveat Lector
    By a whisker.
    Mike Buetow

  • Talking Heads
    Assembléon’s Andre Papoular.
    Mike Buetow


MONEY MATTERS

    • ROI
      Not so golden.
      Peter Bigelow

 

TECH TALK

  • Selective Soldering
    X-ray eyes.
    Alan Cable

  • Tech Tips
    Masked.
    ACI Technologies Inc.

  • Defects Database
    Shedding the coating.
    Dr. Davide Di Maio

  • SMT Troubleshooting
    Solder balls.
    Paul Lotosky

  • Materials World
    Low pressure molding.
    Jie Bai

  • Solar Technologies
    Let’s get small.
    Tom Falcon

  • Technical Abstracts
    In Case You Missed It.

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