Impact of Mesh Size and Stencil Technology on Deposition Volume
A study on the impact on solder volume deposition using Type 3, Type 4 and Type 5 SAC 305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils found that paste chemistry and rheology have a more profound effect on release than previously thought.
by Karl Seelig and Tim O’Neill
Practical Thermal Profile Expectations in a Dual-Lane, Dual-Speed Reflow Oven
Now that we have the ability to run different speeds in each lane, recipes must be devised that satisfy both boards. Here, we discuss methods for obtaining such recipes.
by Fred Dimock
Automated Solder Paste Inspection: A New Look at Stencils
Many assemblers have foisted responsibility for automated inspection and verification onto the stencil vendors, referring to them as “qualified” or “certified” suppliers. In essence, they have placed the fox in charge of the henhouse on a portion of their most critical SMT process. While this practice might look good on paper, it’s rife with potential to backfire and ultimately cost more money than it saves.
by Chrys Shea
EMS Top 50
The Great Rebound of 2010
The electronics manufacturing industry will remember 2010 for many reasons: rampant component shortages (and the rise of counterfeits), the tight financial markets and tense end-market conditions. But mostly, it will be remembered for recovery.
by Mike Buetow
Not so golden.
ACI Technologies Inc.
Shedding the coating.
Dr. Davide Di Maio
In Case You Missed It.