Circuits Assembly April 2010 cover

FEATURES

  • Process Improvement
    The DfM Continuum
    Design and manufacturing often are thought of as separate processes, with some interdependencies. But absent a feedback loop, development will be marred by unnecessary defects and re-spins.
    by John Isaac and Bruce Isbell

  • Signal Integrity
    Open 'Eyes' in the Frequency Domain
    Although final performance is measured in the time domain, a detour may be the faster route to a signal integrity solution.
    by Dr. Eric Bogatin

  • Screen Printing
    Divining Value in Screen Printer Ownership
    The purchase price of a capital item is only one element of value, but it can be one that is disproportionately influential in the purchase decision. A look at how some companies are matching equipment requirements with new ways to evaluate cost-of-ownership.
    by Trevor Warren

  • Screen Printing
    Why Mixed Signal Calls for Precise Stencils
    Stencil accuracy has a direct bearing on the correct thermal profile.
    by Zulki Khan

  • Materials Engineering
    Heat Transfer in LED Assembly
    LEDs may seem cool to the touch, but they all produce heat. So while they offer significant benefits over filament and fluorescent lighting, dissipating heat within an LED assembly involves the selection and use of thermally conductive and (usually) electrically insulating materials.
    by Chuck Neve

  • Service Excellence
    The Big Mack Attack
    For two years running, Mack Technologies has taken home top honors in Circuits Assembly's Service Excellence Awards. Its secret? A customer service strategy based on execution performance and using data, derived through open and honest communication with customers, to drive improvements in performance.
    by Mike Buetow

FIRST PERSON

  • Caveat Lector
    Toyota's painful lesson.
    Mike Buetow
  • Sherman's Market
    No more dips for chips.
    Sandra Winkler

  • Database
    Back to school.
    Pete Waddell

MONEY MATTERS

  • ROI
    Fixing process improvement.
    Peter Bigelow

  • Focus on Business
    Improve workers' lives, improve the bottom line.
    Susan Mucha

TECH TALK

  • Real World EMC
    Designing out radiated emissions.
    Dr. Eric Bogatin

  • Final Finishes
    Process flow and routine analysis.
    Lenora Toscano

  • Screen Printing
    Maintaining the printer.
    Clive Ashmore

  • Selective Soldering
    Hot for preheat.
    Alan Cable

  • Tech Tips
    Corrosion mitigation.
    ACI Technologies Inc.

  • Test and Inspection
    Machine programming.
    Tan Beng Chye

  • Getting Lean
    Balancing tradeoffs of waste elimination.
    Ryan Wooten

  • Wave Soldering Troubleshooting
    Lifted parts.
    Paul Lotosky

  • The Defects Database
    Undissolved fluxes under low-standoff parts.
    Dr. Davide Di Maio

  • Technical Abstracts
    In case you missed it.

 

DEPARTMENTS

Off the Shelf

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