2010 Issues

December 2010 cover

FEATURES

    RETROSPECTIVE
    In Memoriam
    A look back at friends and colleagues who left us in 2010.
    by Mike Buetow

    COVER STORY
    Asteel the One
    Foxconn’s topline growth is enviable, but at least one Tier 2 EMS firm has been expanding almost as quickly, as AsteelFlash is the only Tier 2 (revenues between $500 million and $1 billion) to see sales double over the past decade. CIRCUITS ASSEMBLY goes behind the Asteel curtain to get a glimpse of our EMS Company of the Year.
    by Mike Buetow

    STATIC CONTROL
    ESD Best Practices
    In the case of ESD control, proper practices not only entail high yields, but also no hard or latent defects in parts shipped to customers. Essential features of robust ESD control programs per ANSI/ESD S20.20.
    by Carl Newberg

    SMTAI RECAP
    Good Times in Orlando
    In the technical sessions and on the show floor, SMTAI was a success.
    by Mike Buetow

     

FIRST PERSON

 

MONEY MATTERS

TECH TALK

November 2010 cover

FEATURES

    PCB WEST RECAP
    Hot in the Valley
    Something isn’t getting through, as signal integrity classes were packed even though most designers say they don’t perform the critical analysis.
    by Mike Buetow

    POPCORN PREVENTION
    MSD Protection Steps Per J-STD-033B.1
    ICs can act like a sponge. If they have semi-permeable membranes, moisture from the ambient air can get into those devices. When they get rapidly heated during reflow or rework, the result is rapid outgassing. In some cases, this excessive outgassing causes popcorning, which can damage the internal structures of a component. This how-to helps prevent and rid moisture from components.
    by Don Shell

     

FIRST PERSON

 

MONEY MATTERS

TECH TALK

October 2010 cover

FEATURES

Perfect Paperwork
Best Practices for Preparing Documentation
Electronics assembly documentation includes files such as design schematics, assembly drawings, test procedures, BoMs and more. Problems or omissions in this documentation result in delays and, in extreme cases, may lead to product deficiencies and quality issues. How to ensure documentation for the EMS company is accurate. 
by George Henning

Pick-and-Place
Ensuring Accurate Placement
Placement must undergo various checks to ensure components are the correct ones and to locate potential problems. Matching pad and package sizes is one of the many ways to reduce errors during component assembly.
by Simon Ilustre

 

FIRST PERSON

  • Caveat Lector
    Still like Ike?
    Mike Buetow

 

MONEY MATTERS

  • Global Sourcing
    What DoD cuts mean for the US
    PCB industry.
    Matthew Holzmann

  • ROI
    Do customers know what they want?
    Peter Bigelow

  • Focus on Business
    Program management certification.
    Susan Mucha

 

TECH TALK

    • Screen Printing
      Throw out the area ratio rules.
      Clive Ashmore

    • Selective Soldering
      Fixturing applications.
      Alan Cable

    • Test and Inspection
      ICT for speed.
      Wee-Sheng Yong

    • Defects Database
      Inspecting flux prior to reflow.
      Dr. Davide Di Maio

    • SMT Troubleshooting
      Paste problems.
      Paul Lotosky

    • Tech Tips
      Digital pre-distortion.
      ACI Technologies Inc.

    • Getting Lean
      Dealing with shortages.
      Todd Baggett

    • Technical Abstracts
      In Case You Missed It.

 

 

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