2008 Issues

FEATURES

  • Trade Shows
    What Drives the Crowd?
    A survey of 1,400 North American readers of Circuits Assembly and Printed Circuit Design & Fab finds engineers are most turned on by a great technical conference and location.
    By Mike Buetow

  • Controlling Static
    Mastering ESD Control in Automated Handling Systems
    ESD control has always been critical to high production yields, but programs are generally geared toward operators. The best ESD control programs ensure such equipment is capable of handling highly sensitive devices.
    By Bob Taplett

  • Cover Story
    Beating the RoHS Heat
    Once on the outs over environmental concerns, vapor phase improvements have broadened the process window, reduced changeover time and lowered peak temperatures.
    By Chris Munroe

  • Trade Groups
    Trade Secrets
    Tax-exempt electronics trade associations took in over $110 million in revenues during fiscal 2006. The growth of the sector has led to a first-of-its-kind review of the last three years’ worth of tax filings.
    By Mike Buetow

  • Morey Corp.
    True to Its Roots
    Most EMS companies talk customer service, or technology, or supply-chain management. This family-run Chicago-based company touts something else.
    By Mike Buetow

  • Offshore Expansion
    The Road Abroad – Strategic Alliance or Greenfield Facility?
    A management insider explains the main models for establishing manufacturing in low-cost regions.
    By Paul Plante

FIRST PERSON

  • Caveat Lector
    Fueled up.
    Mike Buetow

  • Letters

  • Talking Heads
    Nihon Superior’s Tetsuro Nishimura.
    Mike Buetow

MONEY MATTERS

  • Focus on Business
    Where trust trumps execution.
    Susan Mucha

TECH TALK

  • On the Forefront
    Embedded applications are coming up.
    E. Jan Vardaman

  • Screen Printing
    Verification and traceability.
    Clive Ashmore

  • Tech Tips
    Intermittent BGA connections.
    American Competitiveness Institute

  • Wave Soldering
    Air and joints.
    Ursula Marquez de Tino

  • Test and Inspection
    Cutting AOI data to size.
    Jeff Bishop

  • Process Doctor
    Inline vs. batch cleaning.
    Ravi Parthasarathy

  • Pb-Free Lessons Learned
    Concerns from the board level.
    Chrys Shea

  • Getting Lean
    Optimizing flow.
    Robert Hemmant

  • Materials World
    Package-on-package configurations.
    Dr. Renzhe Zhao

  • Equipment Advances
    Juki’s FX-3 placement machine.

  • Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Apex Product Preview
Ad Index
Assembly Insider

On the cover: After 30 years, vapor phase is finally finding a place in soldering. (Images courtesy R+D Technical Services)

FEATURES

  • Program Management
    Maximizing Lean
    While customers want flexibility and long-term paths to cost reduction that Lean supports, they aren’t always agreeable to the necessary internal changes. But the smaller the effort, the smaller the result.
    By Todd Baggett

  • Component Packaging
    Copper as a Viable Solution for IC Packaging
    As gold prices spike, some are turning to copper in ball-bonding processes for its conductivity and lower cost.
    By Sheila Rima C. Magno, Jean Ramos, Eduardo Pecolera and Chris Stai

  • Recent Patents
    Embedded Active Components for High-Rel Products
    Inside the missile, a heavy module on the board surface was breaking loose and failing. The answer: A solderless, wire-bonded chip-to-board solution covered with copper "lids" to quell vibration.
    By Jim D. Raby

  • COVER STORY
    XRF Equipment as a RoHS Screening Tool
    A jointly funded industry/DTI collaborative project, led by the National Physical Laboratory, investigated the suitability of XRF techniques for determining the presence and levels of RoHS-restricted substances in typical electronics components. The 15-system study found most – but not all – are viable.
    By Martin Wickham and Dr. Christopher Hunt

FIRST PERSON

  • Caveat Lector
    Rabid for Raby.
    Mike Buetow

  • Letters

MONEY MATTERS

  • Global Sourcing
    Bad parts, like colds, come from anywhere, and no one is immune. A new database might help.
    Mike Buetow

TECH TALK

  • Better Manufacturing
    Keep an eye on vision.
    Phil Zarrow

  • Tech Tips
    Large BGA attachment profiling.
    American Competitiveness Institute

  • Selective Soldering
    Wave or selective for high-rel products?
    Ursula Marquez de Tino

  • Test and Inspection
    The fixture is in.
    Stacy Kalisz Johnson

  • Process Doctor
    Localized extraction clearly shows residue volumes at isolated spots.
    Terry Munson

  • Pb-Free Lessons Learned
    Wake up to the value of boards.
    Chrys Shea

  • Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the cover: An NPL study finds XRF systems beat chemical analysis for unit and operational costs, and time to results. (Photo courtesy RMD Instruments)

FEATURES

  • ESD Control
    Walking on Water
    Winter’s dry air means less humidity – and more static. High-pressure humidification systems can improve air quality and reduce energy costs.
    By Pierre Husson

  • Cover Story
    Flux Selection for Lead-Free Wave Soldering
    This design of experiments clarifies the best types, best available flux within each type, and process limits for each, and also discusses the gaps between the capability of existing flux chemistries and requirements of Pb-free assembly, industry standards and customer expectations.
    By Douglas Watson, Jasbir Bath and Pan Wei Chi

  • Component Inspection
    An A-to-Z Guide to X-Ray Inspection, Part II
    The second of a two-part article looks at practical recommendations for production sampling and viewing various part types.
    By Dr. David Bernard

  • Productronica Recap
    Evolution in Action
    At Productronica, the most radical sight was the transit strike. But the venerable show didn’t disappoint.
    By Mike Buetow

  • iNEMI’s Emerging Technologies
    Research Priorities for the Electronics Industry
    The merger of micro and nano, chemical, and other sensors with micro- and nano-electronics could mean disruption ahead.
    By Alan Rae, Ph.D., Robert C. Pfahl, Ph.D., and Charles Richardson

FIRST PERSON

  • Caveat Lector
    Sanmina-SCI: Poised for recovery?
    Mike Buetow

  • Talking Heads
    Syncro’s Ed Childress and why managing risk is essential to EMS companies.
    Mike Buetow

MONEY MATTERS

  • Focus on Business
    For EMS firms, finding the right trade show to reach customers is tricky business.
    Susan Mucha

TECH TALK

  • On the Forefront
    The cycle continues.
    E. Jan Vardaman

  • Screen Printing
    ‘Ware’ it well.
    Clive Ashmore

  • Better Manufacturing
    Waiting for the revolution.
    Peter Grundy

  • Selective Soldering
    Selective soldering with Pb-free alloys.
    Ursula Marquez de Tino

  • Process Doctor
    Circuit board cleanliness.
    Terry Munson

  • Pb-Free Lessons Learned
    The engineer’s guide to chemistry.
    Chrys Shea

  • Materials World
    Solder spheres and packages.
    Dr. Renzhe Zhao

  • Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the cover: A DoE studies wave-soldered SMDs and through-hole parts. (Cover photo by Vladimir Sazonoff)

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