COB for SMT
Metalization Options for COB Assembly
How they produce different metallurgical interactions with the various die pad and substrate metalizations, the resulting intermetallic structures and growth, and how they impact reliability and cost.
A Test Comparison of SAC and Non-SAC Pb-Free Solders
SAC 305 is the de facto Pb-free solder, but many industry tests have failed to take non-SAC alloys into consideration, nor have tests been performed for any other soldering process (such as wave or selective soldering).
Howard P. Stevens
An A-to-Z Guide to X-Ray Inspection
X-ray inspection is a way to inspect solder joints and locations in a nondestructive manner with products that cannot be inspected optically, such as BGAs and CSPs. It can also be used to investigate the wire attachment quality within semiconductor device packages and certain SMT components. More recently, x-ray techniques have been used for production quality and process control.
Dr. David Bernard
BEST: A ‘Funky Chicken’ with an EMS Niche
How the 2007 SEA winner for rework and repair uses the customer service survey feedback to identify trends in areas that may need improvement and determine areas of strength.
The world's waste shop.
Balver Zinn’s Josef Jost
Verifying material integrity.
A defective theory.
Dr. Rita Mohanty
Occam? Not quite yet.
Forming package-on-package PCBs.
American Competitiveness Institute
Black powdery oxides.
Ursula Marquez de Tino
Pb-Free Lessons Learned
MCSBs in SAC 305 vs. SnPb.
Business improvement systems.
Eastern Approaches (Chinese PDF)
SMT traceabilities, part 2.
Cai San Qiang
On the cover: Understanding 2-D x-ray inspection. (Photo courtesy Dage Precision Industries)