R&D Needs for Packaging
Two areas of research that have evolved quickly during the last two years are SiP and 3-D packaging. The iNEMI Roadmap highlights the approaches and clarifies industry needs.
The Learning Organization
Key Electronics’ never-ending pursuit of improvements has boosted it to consecutive Service Excellence Awards.
A Study of 0201s and Tombstoning in Pb-Free Systems
Tombstoning is reported to occur more frequently in Pb-free systems, and smaller components are at greater risk than larger ones. A comprehensive DoE finds paste and placement offsets to be the top contributor to defects.
Paul Neathway, Andrew Butterfield, Quyen Chu, Nick Tokotch, Robert Haddick, Jean-Marc Peallat, Chrys Shea and Prashant Chouta
BGA Assembly with Low-Ag Alloy Spheres
It is possible – under certain process and assembly conditions. However, assemblers must be aware of the impending change, best communicated through a part number change.
Girish Wable and Paul Neathway
Selective Soldering for High-Volume Assembly
In an EMS environment, selective soldering, using a nozzle pattern, eliminated masking, excessive flux and pallet washing. Solder splashes were eliminated, and overall quality improved drastically.
Customizing the printer.
Dr. Rita Mohanty
Leave the Windex in the cabinet.
Dr. H.J. Zapfardt
Is bridging random or not?
Pb-Free Lessons Learned
PWB positional inaccuracies.
A ROSA by any other name.
American Competitiveness Institute
Post-selective soldering heating benefits.
Seeing is believing.
Cai San Qiang
Productronica Product Preview
On the cover: Tombstoning is an omen for process engineers. (Photos courtesy Jabil)