A Study of Copper Dissolution During Pb-Free PTH Rework Using a Thermally Massive Test Vehicle
A smaller process window exists when using SAC for solder fountain rework due to high copper dissolution rates when compared to a conventional SnPb process. The first of a two-part study.
Craig Hamilton, Matthew Kelly, and Polina Snugovsky, Ph.D.
‘Chiplets’ Create Multi-Species MCMs
A new, somewhat daring method for packaging devices under development involves etching a pit in the surface of a silicon wafer, then inserting a tiny patterned chip (“chiplet”), which is then interconnected to other chips.
Keith Gurnett and Tom Adams
More complex PCBs require better defect recognition than 2-D x-ray provides, but faster speeds than conventional 3-D.
‘If We’re Not Number One, We Have Work To Do’
Circuits Assembly’s Service Excellence Awards winner Mack Technologies explains its approach to customer service.
Military programs are under fire.
Vertical makes a comeback.
On the Forefront
E. Jan Vardaman
Printing 0.3 mm CSPs.
Integrating NPI into the routine.
Locating your shorts.
American Competitiveness Institute
Impurities: Harmless or not?
Gerjan Diepstraten and Gert Schouten
Test and Inspection
Get in touch with remote technologies.
Stacy Kalisz Johnson
Pb-Free Lessons Learned
No history? No problem!
Dr. Renzhe Zhao
On the cover: SAC alloy use has been tied to increased copper dissolution. (Photos courtesy IBM and Celestica)