A Novel Low CTE, High Stiffness Ceramic Composite Core
A new substrate meets attributes for solder joint reliability, dielectric reliability, low warpage and microvia reliability.
Nitesh Kumbhat, P. Markondeya Raj, Raghuram V. Pucha, Venky Sundaram, Ed Bongio, S. Sitaraman and Rao R. Tummala
2007: The Year of HDI?
Our survey of more than 5,100 subscribers reveals this will be the year microvias and embedded passives join the ranks of conventional technology.
EMS Business Models
Outsourcing Technology Enhancement
One-stop shopping is highly touted within the EMS industry, but the formula has variations – and warts. Using strategic alliances to support application-specific technology enhancement can provide access to more specialized expertise and optimum resource utilization.
The Moisture Sensitivity Standard Goes Pb-Free
The updated industry spec for characterizing components, J-STD-020D, gives the boot to the peak package body temperature (Tp) term.
Tom Adams and Steve Martell
America’s Best Manufacturer?
Emerging from the shadow of former parent IBM, Endicott Interconnect Technologies is coming off its best year and primed for growth.
Improving ESD Program Discipline
A detailed look at how General Dynamics manages its ESD auditing and training procedures.
James Colnar and Roger Peirce
China’s latest irony
Focus on Business
EMS firms get specialized.
On the Forefront
The outlook is mixed for 2007.
E. Jan Vardaman
Thermal interface materials: print or dispense?
Banish the big box.
Intermetallic growth and micro-voiding.
American Competitiveness Institute
Two alloys, one line.
Test and Inspection
Vectorless test’s evolution.
The EU’s next directive review.
Pb-Free Lessons Learned
Myths of the solder bath.
Universal’s high-speed pick-and-place.
APEX Product Preview
On the cover: Highly engineered boards are the specialty of Endicott Interconnect. (Photo courtesy Endicott Interconnect)