Circuits Assembly Online Magazine

Apex Recap
Small Firms, Big Ideas
Thanks in part to the RoHS conversion, companies are busier today than a year ago, but few are thinking about what to do once the Pb-free buzz ends. Plus: Excellence in service.
Mike Buetow and Robin Norvell
AXI Comparison
AXI Test on Fine-Pitch Components Using Pb-Free and SnPb
A powerful tool for process characterization during the transition to Pb-free solder, this study revealed less than 10% difference for Pb-free and SnPb TVs under different test coupons.
Zhen (Jane) Feng, Ph.D., Eduardo Toledo, Dason Cheung, Jeff Newbrough and Murad Kurwa
Cover Story
Running Pb-Free Reflow Profiles without Nitrogen
TGA/DSC data show paste can be used in extended reflow profiles with reduced dT's even at fast printing speeds.
Eli Westerlaken
Reflow Soldering
A Comparison of Convection and Condensation Pb-Free Reflow Soldering
Convection runs at faster cycle times, while condensation is superior for heavier PCBs.
Dr. Hans Bell
Underfill Characterization
A Fixture for Characterizing Underfill
How a simple slab of aluminum and a slot to contain a little pane of tempered glass, ringed by adjustable clamps, can aid visibility.
Tom Clifford

On the Forefront
Maxed out.
E. Jan Vardaman
Screen Printing
'Tidying up' the process.
Clive Ashmore
Better Manufacturing
X-ray goes under the microscope.
Peter Grundy
Soldering Tips
BGA repair for mixed assemblies.
American Competitiveness Institute
Wave Soldering
Avoiding solder spikes.
Gerjan Diepstraten
Countdown to Pb-Free
RoHS and China.
Richard (Tad) Ferris and Hongjun Zhang, Ph.D.
Equipment Advances
Europlacer's component positioning system.
Technical Abstracts

Assembly Insider
Industry News
Market Watch
Ad Index
Nepcon East Product Preview
Classifieds

On the cover: Solder bumps are shown during reflow in air. (Courtesy Cobar Europe BV)

2006 Magazine Archives