caLogo

July 2005 cover

FEATURES

  • Process Improvement
    Reducing BGA Defects with AXI Inspection
    How large can a BGA void be and still be considered acceptable? This study established the ideal sensitivity setting for catching BGA voids.
    Zhen (Jane) Feng, Ph.D., Eduardo Toledo, Jonathan Jian and Murad Kurwa

  • ROHS Compliance
    RoHS and the Supply Chain
    The time is at hand to switch to lead-free parts. What are the issues involved?
    Chris Reynolds

  • IC Testing
    The Basics of Boundary Scan
    Eliminate ICT and functional test while reusing test data.
    Stefan Meissner

  • Ag Solderability
    Wetting Characteristics of Pb-Free Alloys of Interest
    Regardless of flux, silver-containing alloys can achieve acceptable wetting at high temperatures.
    Anna Lifton, Ronald A. Bulwith and Louis M. Picchione

  • Cover Story
    Stencil Design for Pb-Free SMT Assembly
    The new process will require a few tweaks from SnPb standards.
    Chrys Shea

  • Optical Inspection
    Pb-Free Flip Chip and CSP Inspection
    A review of failure analysis data for area arrays used in Pb-free soldering shows topside ball delamination that x-ray alone cannot detect. A new nondestructive optical inspection technology can, however.
    Mark Cannon and Juergen Friedrich

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Assembly Insider
Industry News
Market Watch
Product Spotlight
Ad Index
Classifieds

On the cover: "Homeplate" apertures will be replaced by a variety of new designs. (David Gilder)

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
Don't have an account yet? Register Now!

Sign in to your account