August 2005 cover

FEATURES

  • AOI Pitfalls
    Poor Vision
    The value of inspection is overshadowed by software issues and floor management.
    Matt Holzmann

  • Cover Story
    Pb-Free, Moisture Sensitivity and X-Ray Inspection
    Parts absorb considerably more moisture during lead-free assembly. X-ray can spot the subsequent solder joint problems.
    David Bernard, Ph.D.

  • CAM Automation
    Not-So-Secret Codes
    Never change CAM automation on a Friday, and other lessons of software integration.
    Stephen Potter

  • Component Packaging
    MEMS in Medicine
    How these next-generation components are changing a vital application for electronics.
    Ken Gilleo, Ph.D.

  • Pb-Free Transition
    Converting Wave Soldering Equipment to Pb-Free
    Install a new solder pot in just an hour.
    Lee Whiteman, Jeff Stong and Debbie Alavezos

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Assembly Insider
Industry News
Market Watch
Ad Index
ATExpo Product Preview
Nepcon Southeast China Product Preview

On the cover: X-ray's role in lead-free assembly. ( iStockphoto Inc.)

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