Reducing BGA Defects with AXI Inspection
How large can a BGA void be and still be considered acceptable? This study established the ideal sensitivity setting for catching BGA voids.
Zhen (Jane) Feng, Ph.D., Eduardo Toledo, Jonathan Jian and Murad Kurwa
RoHS and the Supply Chain
The time is at hand to switch to lead-free parts. What are the issues involved?
The Basics of Boundary Scan
Eliminate ICT and functional test while reusing test data.
Wetting Characteristics of Pb-Free Alloys of Interest
Regardless of flux, silver-containing alloys can achieve acceptable wetting at high temperatures.
Anna Lifton, Ronald A. Bulwith and Louis M. Picchione
Stencil Design for Pb-Free SMT Assembly
The new process will require a few tweaks from SnPb standards.
Pb-Free Flip Chip and CSP Inspection
A review of failure analysis data for area arrays used in Pb-free soldering shows topside ball delamination that x-ray alone cannot detect. A new nondestructive optical inspection technology can, however.
Mark Cannon and Juergen Friedrich
Ron Daniels, 1948-2005.
SMT Resource's Malcolm Montanjees.
On the Forefront
3-D: Looking good.
E. Jan Vardaman
Laser: A "cut" above plastic?
R's and C's of embedding passives.
Countdown to Pb-Free
Equipment changes for Pb-free soldering.
NEW: Wave Soldering
Controlling the wave.
Test and Inspection
Process characterization made easy.
Stig Oresjo, Thorsten Niermeyer and Stacy Johnson
Testing optoelectronic components.
Silver and green.
On the cover: "Homeplate" apertures will be replaced by a variety of new designs. (David Gilder)