Design and Assembly of 01005 Passives Using Pb-Free Solder
The good news: It can be done. This study of pad sizes and stencil apertures, placement, reflow and test offers a blueprint for success.
Fredrik Mattsson, David Geiger, Dr. Dongkai Shangguan and Todd Castello
PBGA Package Warpage and Impact on Traditional MSL Classification for Pb-Free Assembly
The classification criteria of J-STD-020C may need updating in light of these warpage results.
B.T. Vaccaro, R.L. Shook, E. Thomas, J.J. Gilbert, C. Horvath, A. Dairo and G.J. Libricz
AOI Setup Basics
Handling Failed Product after AOI
Common manufacturing options for handling product after AOI, and considerations for sorting and repair of inspected product.
Steps to Develop and Promote Indian EMS
India is finding its way in the EMS world. Here’s what it still needs to do.
Placement Challenges of 0201s
Most defects are traced to placement, and 0201s compound the potential for havoc. Here’s how to overcome size and spacing issues.
Shawn Robinson and James Lamuraglia
Issues in Outsourcing Pb-Free Prototypes
Short-run producers face two types of challenges: supply-base and process. They have to figure out all the same process changes, but on a shorter time schedule.
Elliot Shev, Brian Wycoff and Michelle Saumur
In D.C., cash is still king.
Speedline’s Pierre de Villemejane
Focus on Business
Aligning sales teams with business models.
More inventory, more profit?
On the Forefront
RFID tag, you’re it!
E. Jan Vardaman
Other applications for screen printers.
Cleaning up after Kyoto.
When to outsource opto build.
Test and Inspection
AOI and SPI can ease the lead-free transition.
Stig Oresjo, Thorsten Niermeyer and Stacy Johnson
Countdown to Pb-Free
Lead-free soldering takes a bath.
Denis Barbini, Ph.D., and Paul Wang, Ph.D.
Cross-sections: Still a cut above.
Nepcon East Product Preview
On the cover: Placing the next generation of chips requires new feeders and better vision. (Universal Instruments Corp.)