January 2005 cover

FEATURES

  • Cover Story
    Optimizing Pb-Free SMT Process Parameters
    A Taguchi approach reveals the most important process steps and best settings for screen-printing and reflow, as well as the best combination of paste and board finishes for lead-free soldering.
    Antonio Buonomo, Alessandro Lo Schiavo and Fabrizio Rotulo

  • Packaging
    A New, Thin High-Performance Organic Substrate
    A new flip-chip package can be conventionally processed and meets lead-free demands, all while surpassing 10 GHz performance tests.
    Donald Banks, Robin Gorrell, Duy Le-Huu, David Hanson and Shichun Qu

  • Purchasing
    The Circuits Assembly Buyers' Guide
    Our annual directory of products, services and suppliers.

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On the cover: This month's top story lists the optimum reflow and printing settings for lead-free alloys. (© Gencay M. Emin)

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