WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and Polar Semiconductor. The incentives, which are part of the CHIPS and Science Act, will support the expansion of Polar Semiconductor’s chip production capabilities in Minnesota, allowing Polar to double its U.S. fabrication capacity of sensor and power chips within two years and serve diverse market segments. As part of the announcement, Polar Semiconductor will also transition to become a U.S. majority-owned commercial foundry.

The Commerce Department previously announced incentives for Micron, Samsung, TSMC, Intel, GlobalFoundries, Microchip Technology, and BAE Systems.

“Today’s announcement will help Polar Semiconductor expand and innovate its production capabilities, enabling the company to better supply crucial U.S. industries like automotive, aerospace, defense, and medical devices. These incentives will continue to advance the critical priorities of the CHIPS and Science Act, bringing more semiconductor production, jobs, and innovation to U.S. shores. We commend Polar for its significant U.S.-based investments and applaud the U.S. Commerce Department for working to keep the CHIPS Act on track for success. We look forward to continuing to work with leaders in government and industry to ensure the CHIPS Act continues to reinvigorate U.S. chip manufacturing and research and development.”

The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced more than 80 new projects across 25 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 56,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

An SIA-Boston Consulting Group report released last week projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032, ranking second only to Taiwan (31%).

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Upper Midwest Expo & Tech Forum taking place on June 4 at Union Depot in St. Paul, Minnesota. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Upper Midwest Expo & Tech Forum on June 4th, or visit www.aimsolder.com 

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX ® MX2123 Multi-Process Power Module Cleaner.

MICRONOX MX2123 is a cutting-edge, aqueous, multi- phase chemistry meticulously crafted to eliminate flux residues from various IGBT module devices employing a combination of copper, silver and nickel DBC substrates, alongside PCBs. With its precisely balanced formula, MX2123 ensures exceptional surface conditions for subsequent wire bonding and potting processes, while safeguarding base metals with its retention of anti- oxidation materials like Organic Solderability Preservative (OSP) post-cleaning.

Renowned for its effectiveness at low temperature and concentration levels, MX2123 can be effortlessly monitored in both in-line SIA cleaning systems and Ultrasonic Immersion cleaning systems.

PCIM Europe is a premier event for power electronics and its applications, offering a platform for industry leaders to showcase the latest innovations and technologies. For more information about KYZEN and its advanced packaging solutions, stop by Hall 5, Stand 100 or visit www.kyzen.com 

NORTH BILLERICA, MA – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce its participation in SMTconnect 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. The company will exhibit its latest innovations in reflow technology at the booths of its manufacturers' representatives, ANS answer elektronik Service- & Vertriebs GmbH and Stratus Vision GmbH.

ANS, located at Hall 4, Booths 245-345, and Stratus Vision, located in Hall 4 Booth 247, will host BTU International's advanced reflow solutions. BTU will feature its Pyramax 100A unit in the ANS booth and the Aqua Scrub™ Flux Management unit in the Stratus booth, offering attendees firsthand experience with state-of-the-art thermal processing equipment.

The Pyramax 100A reflow oven integrates advanced features, including closed-loop convection control and the Wincon oven control system, to deliver superior performance and reliability within a compact footprint. Designed to meet the evolving demands of modern electronics manufacturing, the Pyramax 100A ensures precise temperature control and uniform heating for optimal soldering results.

In the Stratus Vision booth, BTU International will highlight its Aqua Scrub™ Flux Management Technology. This next-generation solder reflow flux management system is engineered to significantly reduce operational costs compared to traditional condensation systems. Aqua Scrub's patent-pending design utilizes aqueous-based scrubber technology compatible with a wide range of paste and flux types, offering enhanced efficiency and productivity while drastically lowering scheduled downtime. The Aqua Scrub flux management system is designed within the new Aurora platform of reflow ovens and can also be retrofitted to current Pyramax units.

Company representatives will discuss how the new Aurora platform is guiding the way to the lights out Industry 4.0 factory of the future by seeing reflow in a new light. Implementing the industry’s first factory configurable heating and cooling zones provides the flexibility to customize your reflow oven for specific product/process characteristics including very heavy boards, slow cooling constraints, or increased throughput requirements.

For a hands-on view of the BTU equipment and its portfolio of thermal processing solutions, please visit ANS at Hall 4, Booth 245-345 and Stratus Vision at Hall 4, Booth 247 at SMTconnect 2024.

To learn more visit www.btu.com