CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany. Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and drive green technologies of tomorrow, such as e-Mobility. These proven materials have also been shown to solve customers’ warpage issues while ensuring high reliability and improving overall efficiency.

Among its featured products, Indium Corporation will showcase:

• Durafuse® HT – an innovative Pb-free solution based on a novel alloy technology designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
• Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents delamination and warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.
• QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE™ range of pressure sinter pastes:
  • InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications; InFORCE™29 features high workability, making it suitable for printing or dispensing applications.
  • InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications; InFORCE™MF is specially formulated for printing applications, providing low process yield loss due to print defects.
  • InFORCE™ LA – a pressure silver sinter paste formulated for sintering of areas greater than 100mm2. Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #466.

NEW YORK – Kubler US Corp., a leader in providing smart inventory management technology, is thrilled to announce its strategic partnership with FHP Reps for the distribution of Arcadia products across Texas, Louisiana, Arkansas, Oklahoma, Kansas, and Missouri. This collaboration aims to leverage FHP Reps’ extensive network and expertise to enhance the regional availability and support for Arcadia's innovative solutions.

Keith Favre, co-founder of FHP Reps, expressed his enthusiasm for the new partnership, stating, “Arcadia products represent the pinnacle of inventory management technology. Their efficiency and reliability perfectly align with our commitment to offering top-tier solutions to our customers.”

Boris Kübler, CEO of Kubler US Corp., also shared his excitement about the opportunities this expansion brings. “We are incredibly excited to work with FHP Reps. Their deep market penetration and seasoned expertise in the region are invaluable as we aim to meet the growing demand for advanced manufacturing solutions.”

Arcadia, known for its cutting-edge smart storage systems such as the ARCHIMEDE system, provides state-of-the-art inventory management solutions that are essential for modern manufacturing environments. This partnership is expected to enhance service delivery and customer support, ensuring that clients in the designated territories have optimal access to Arcadia’s products.

For more information about the Arcadia Archimedes Smart Storage System, visit PRODUCTS | Arcadia (arcadiasrl.it).

CLINTON, NY – Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.

To address the impending need for replacement of high-lead (Hi-Pb) solders in die-attach and clip-bond usage for power discrete semiconductor applications, tin-antimony (SnSb)-based solder pastes have been developed with Indium Corporation’s patented Durafuse® technology, which combines the merits of the two constituent powders. The study found that the mechanical strength of the reflowed joints around temperatures of 260°C or higher, inherited from the Sb-bearing powder, was still comparable to or stronger than high-lead solders.

“Although the current technology supporting lead-free materials is not yet sufficient to replace commonly used high-Pb options for this application, the results of this study may signal a potential way forward,” said Aserian. “I look forward to sharing these promising findings, as well as the challenges still present with my colleagues at ECTC.”

Since joining Indium Corporation in 2022, Aserian has been at the forefront of designing and executing experiments to test the efficacy of new and existing alloys. His work involves creating processing windows tailored to customers’ needs, ensuring stringent quality inspection, devising innovative test methods, and reliability testing for developed soldering materials.

Indium Corporation Senior Research Chemist Dr. Guangyu Fan and Research Associate Jacob Wells will also present a poster at the conference, Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices.

This poster examines recent efforts to develop liquid metal TIMs containing organic compounds (LMO) that enhance the deposit process and thermal performance for improved thermal management in electronic devices. The thermal conductivity, resistance, and reliability of LMOs and LMAs were measured using TIMA 5 (ASTM-D5470) and evaluated by a house-made power cycler, respectively.

REDDITCH, UK – Altus Group, a leading distributor of capital equipment in the UK and Ireland, has announced the addition of PVA's new PathMaster X software to its product portfolio. PathMaster X transforms programming for PVA's conformal coating and dispensing systems with an intuitive, game-like controller interface.

PathMaster X is the next generation of Windows-based programming software from PVA, a leading manufacturer of conformal coating and dispensing systems. It provides greater control, advanced programming, and a fully configurable platform tailored to individual production needs.

Joe Booth, CEO of Altus Group said: "We're excited to offer the new PVA PathMaster X. This innovative software delivers an unparalleled user experience by combining advanced programming capabilities with gaming-inspired controls. Our customers will find PathMaster X incredibly easy to use for optimising their coating and dispensing processes.

"Altus Group customers now have access to PVA's innovative PathMaster X for simplifying their coating and dispensing operations. This software meets the high standards of innovation and performance our customers have come to expect."

The PVA X-Pad controller and touchscreen monitor allow machine operation, programming, and monitoring through an intuitive interface. Users can utilise the gaming controller-style interface with custom virtual buttons for an engaging programming experience akin to playing a video game.

PathMaster X offers a configurable workspace for conformal coating, dispensing, and custom applications. Its advanced online/offline programming enables users to program from anywhere. The intuitive drag-and-drop interface, custom overlays for valve size/pattern width, and other intelligent features streamline programming workflow.